Tearing in Bond Graphs With Dependent Storage Elements
Keywords
- Bond Graphs
- Dependent Storage Elements
- DAE Systems
- Residual Sinks
- Tearing
Abstract
In a previous paper, we have shown that information about possible tearing
variables added to a Bond Graph (BG) with dependent storage elements can be
exploited by a program like Dymola, if the stores are replaced by a so-called
resistive companion model originally introduced in integrated circuit analysis.
In this paper, it is shown how tearing information added to a BG with causal
paths between stores of the same type can be exploited directly by a program
like Dymola, allowing for a mixed symbolic and numerical solution of the
underlying Differential Algebraic Equation (DAE) system. For didactic reasons,
the method is explained by means of some fairly small examples. Nevertheless,
it is quite general.
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Last modified: June 15, 2005 -- © François Cellier